Y5030010005 4602nm Gas detection Specification

Name: Y5030010005 4602nm Gas detection Specification
Brand: 武汉友阳光电有限公司 | 致力于器件模块的垂直整合能力
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所属分类： QCL

Features:High output power

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PN: Y5030010005

4602nm Gas detection Specification

Features

High output power
Internal TEC (Thermoelectric Cooler) and thermistor

Description

The 4602nm single-mode DFB has become an ideal choice for high-demand sensing system applications.The laser has a high output power, and 4602nm wavelength DFB making this laser ideal for Carbon Monoxide (CO) sensing.

Absolute Maximum Ratings

Table 1 - Absolute Maximum Ratings

Parameter	Symbol	Min.	Max
StorageTemperature	℃	-40	85
OperatingTemperature	℃	15	45
Reverse Voltage (Laser Diode)	V	-	10
Laser forward current(T=25℃)	mA	-	120

Optical and Electrical Characteristics of Transmitter and Receiver

Characteristics( Tc=25℃（ambient temperature),unless other specified)

Transmitter
Parameter	Symbol	Min.	Typ	Max	Unit	Note
Threshold Current	Ith	-	-	45	mA	CW
Output Optical Power	Po	10	-	-	mW	Iop=60mA, CW，TEC=35℃
Operating Voltage	Vf	-	-	8.5	V	Iop=60mA, CW，TEC=35℃
Slop Efficiency	Se	0.33	-	-	mW/mA	Iop=60mA, CW，TEC=35℃
Peak Wavelength	λp	4600.5	4602	4603.5	nm	Iop=60mA, CW，TEC=35℃
Side Mode Suppression Ratio	SMSR	20	-	-	dB	Iop=60mA, CW，TEC=35℃
Thermoelectric Cooler Current	Itec	-	-	1.2	A
Thermistor	-	9.5	10	10.5	KΩ

Mechanical Design Diagram and Pin DefinitionsThe mechanical design diagram is shown in Figure 1. (Dimension in mm)

Precautions

Semiconductor chips are sensitive to electro-static damage. The module shall be packed with antistatic material for transportation. The working station and operators shall be grounded. Switching transients can cause electrical overstress (EOS) damage to the chips. EOS be may resulted from improper ESD handling, improper power sequencing, a faulty power supply or an intermittent connection.

a. Operators should always use antistatic bands and clothing, electric conductive shoes, and other safety appliances while at work are highly recommended.

b. Humidity in working environment should be controlled equal or above 40 percent RH.

c. It is recommended that grounding mats be placed on the surfaces of assembly line workbench and the surrounding floor in working area, etc.

d. When mounting this product in other parts or materials which can be electrically charged (printed wiring boards, plastic products, etc.), pay close attention to the static electricity in those parts.ESD may damage the product.

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